DNA-e – Hex Polishing Foam Pad (5.5″)

DNA-e Hex Medium/Heavy Cut Pad is a firm, high density foam pad that is ideal for scratch and defect removal. This pad offers the correction of a typical compounding pad while at the same time allowing the polishing ability of a light cut foam pad. When used with heavier compounds it will remove moderate swirls and scratches with little or no haze. It is an all-around pad that will work on most light to moderate imperfections.

• Imported German Foam.
• Well balanced
• Can be used on to DA/RO machine
• Good heat dissipation.
• High-quality hook&loop material.
• Long service life, can be washed and reused.

Spec:

• Hook and look diameter: 130mm
• Polishing surface diameter: 150mm
• Recommended backing plate size: 125mm
• Due to the numerous factors involved in machine polishing, polishing pads carry no warranty.